CMP设备中抛光垫修整机构的研究

Study on Pad Conditioner in 300mm Silicon Wafer Chemical Mechanical Polishing Equipment

介绍了一种新型抛光垫修整机构的功能、结构及运动原理,通过理论计算给出了修整力的计算公式,并介绍了一种原理简单,操作方便的气动控制系统。在工艺试验过程中,充分证明了其结构原理及控制系统的合理性,进而在理论和实践两个方面确定了该机构已达到设计要求。

It introduces the function, structure theory and movement theory of a new pad conditioner, it provides a calculational formula of conditioning force through theoretic calculation. It introduces a pneumatic control system with simple theory and convenient manipulation. During technical experiment, it proves rationality of structure theory and control system sufficiently. Consequently, it confirms that the structure has achieved design require basically from theorv and nractice.