钼铜的低温导热研究

Investigation on Thermal Conductivity of Mo-Cu at Low Temperature

研究了熔渗法制备的Mo-Cu复合材料从350～20 K的导热率变化。结果表明,该材料在350 K的导热率为200 W/(m.K)。随着温度降低,导热率降低,降温至200 K后导热率升高,20 K时导热率达305 W/(m.K)。将样品用浓硝酸腐蚀去除铜组分后观察微观组织发现,Mo在熔渗制备过程中已烧结成骨架结构,这种结构的形成是低温材料导热率升高的原因。

The thermal conductivity of Mo-Cu prepared by melt infiltration at 350-20 K was measured.The results show that the thermal conductivity（TC） of the alloy is 200 W/（m·K） at 350 K.The TC decreases with the temperature reducing.The TC elevated below 200 K and achieved a maximum of 305 W/（m·K） at 20 K.The microstructure of the sample which corroded by nitric acid was observed by SEM.The results show that the Mo has been sintered into skeleton structure in the preparation process,which is the reason for the TC elevation at low temperature.