电感耦合等离子体发射光谱法同时测定粗铜中金和银

Simultaneous determination of gold and silver in blister copper by inductively coupled plasma atomic emission spectrometry

粗铜样品用盐酸和硝酸混合酸溶解,选择242.794nm和328.068nm的光谱线分别作为金和银的分析线,直接用电感耦合等离子体发射光谱法(ICP-AES)同时测定了粗铜中金和银含量。考察了基体效应和共存离子等因素对测定的影响。实验表明,铜存在基体效应对测定有影响,但可以采用基体匹配的方法消除,粗铜中的其他杂质元素对测定没有影响。用本法测定了粗铜中的金和银含量,测定值与行业标准方法(YS/T521.2-2009)的测定值相符,金、银测定结果的相对标准偏差分别小于1.9%和1.1%(n=12),加标回收率在95%～105%之间。

Blister copper sample were dissolved in mixed acid of hydrochloric acid and nitric acid.Gold and silver content was determined directly by inductively coupled plasma optical emission spectrometry（ICP-OES） by using 242.794 nm and 328.068 nm as analyzing spectral line.Investigation of the effects of matrix and co-existing ions were studied.It was shown that copper had certain effect on the determination,but can be removed by matrix-matching,while other impurity elements had no influence.The method has been applied to the blister copper and the results are consistent with the results by the method of YS/T521.2-2009,with the relative standard deviations of gold and silver（RSD,n=12） smaller than 1.9 % and 1.1 % respectively.In addition,the recoveries of testing elements were between 95 % and 105 %.