适用于大功率光电芯片散热的一体化平板热管

Integrated flat heat pipe for cooling high-power optoelectronic chip

为解决大功率光电芯片散热问题,构造了一种新结构一体化平板热管。利用超轻多孔泡沫金属作为毛细吸液芯,以水、丙酮和乙醇为工质,在不同充液比、加热功率和倾角条件下对新结构热管的热性能进行了研究,结果表明,这种新结构平板热管不仅消除了热管与散热片间的接触热阻,而且使整个散热翅片也处于均温状态,当功率达到380W、热流密度超过445 W/cm2时,热管仍具有较好的均温特性,且热阻较小,可达0.04℃/W。在3种工质中,水是最佳工质选择,且当充液比为30%时具有较好的效果。实验表明,以泡沫金属为吸液芯的新结构一体化平板热管具有很好的传热性能,并扩展了承载大热流密度的能力。

An integrated flat heat pipe with new structure was fabricated to solve the problem of cooling high-power optoelectronic chip. Experiments were conducted to study the effects of filling ratio of liquid, heating power and inclination angle on the thermal performance of flat heat pipe with ultra-light porous foam metal as capillary wick,and water,acetone and ethanol as working fluid. The results show that the new structure flat heat pipe not only eliminates contact resistance between flat heat pipe and heat sink, but also improves temperature uniformity on cooling fin surfaces. When the heat power is up to 380 W, the heat flux is over 445 W/cm2 ,the new structure flat heat pipe still has good temperature uniformity and the thermal resistance is 0.04 K/W. In three kinds of liquid,water is the best to be used as working fluid. As the filling ratio is 30; ,the flat heat pipe has the optimal heat transfer performance. The results indicate that the new structure integrated fiat heat pipe with foam metal as capillary wick has good heat transfer performance and can dissipate high heat flux,which is suitable for cooling high-power optoelectronic chip.