摘要
采用有限元分析软件ANSYS,分别对基于均温基板和金属芯印刷电路板结合太阳花散热器的100 W的大功率集成封装白光LED进行了热分析。结果发现:(1)相比金属芯印刷电路板,均温基板提高了LED芯片的均温性,可使每个LED芯片的温度分布一致,且每个芯片的最高温度比最低温度仅高1.1℃,避免了局部热点,从而提高了大功率集成封装白光LED的可靠性,保证了它的寿命。(2)太阳花散热器非常适合大功率集成封装白光LED模组的散热。因此对于大功率集成封装白光LED模组而言,均温基板结合太阳花散热器是一种有效的散热方式。
Thermal analysis of high power integrated package white LED module based on vapor chamber printed circuit board（VCPCB） and metal core printed circuit board（MCPCB） combined with sunflower heat sink were presented,respectively by using finite element analysis software ANSYS.Results show that firstly,compared with MCPCB,VCPCB improved temperature uniformity of LED chips,the temperature distribution of each chip is identical,the highest temperature of each chip is only 1.1 ℃ higher than the lowest temperature,and avoided local hotspots,thereby improved reliability of the module and ensured its lifetime.Sunflower heat sink is excellent for heat dissipation of the module.Therefore,VCPCB combined with sunflower heat sink is a powerful way for heat dissipation of the module.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2012年第9期63-67,共5页
Electronic Components And Materials
基金
国家科技支撑计划"863"资助项目(No.2011BAE01B14))
广西研究生教育创新计划资助项目(No.2011105950802M04)
关键词
LED
集成封装
均温基板
均温性
可靠性
LED
integrated package
VCPCB
temperature uniformity
reliability
