苯并噁嗪高性能化应用研究进展

Progress in Research on Benzoxazines with High Performance

苯并噁嗪树脂具有低黏度,耐潮性优异,线性膨胀系数低和耐热性较高的优点,现广泛应用于电子电气、航空航天和汽车工业中。将苯并噁嗪树脂引入到电子封装材料中,以制备耐潮、耐热和可加工性能优异的满足新型封装要求的高性能电子封装材料,这些都需要对其进行结构改造。就苯并噁嗪树脂应用研究中存在的高耐热高阻燃性、增韧可加工性、低温固化工艺以及优良电性能方面的改性进行探讨,指出了通过分子设计结构、有机无机共混共聚及固化工艺改进等几种解决途径。

As the benzoxazine has the properties of low-viscosity, good humidity-resistance, low coefficient of thermal expansion and high heat- resistance, benzoxazine resin has been applied in the fields of electrical and electronic, aeronautics and space and the automobile industry. A series of novel electronic encapsulation materials possessing excellent properties （such as moisture resistance, heat resistance and processability） based on ben- zoxazine resins have been developed. The modification methods for the heat-resistance, flame-retardance, toughening and low temperature curing of benzoxazine are discussed, including molecule structure design, organic and inorganic blending and copolymerization, improving the curing technology.