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玻璃与铝共阳极连接工艺研究及界面机理分析 被引量:1

Research and Interface Mechanism Analysis of Glass and Aluminum Public Anode Bonding Process
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摘要 研究了铝与玻璃的阳极连接方法,采用公共阳极法和直流电源实现了玻璃/铝/玻璃的多层连接,这为多层晶片的连接以及复杂微电子装置的设计提供方法和理论基础。通过SEM、EDS和GD-OES分析手段分析了玻璃/铝的结合界面。采用instron-5544万能材料试验机进行拉伸实验发现断裂发生在玻璃基体中,这表明界面的结合强度高于玻璃基体的强度,SEM断口形貌分析表明断裂界面呈贝壳状的解理断面,说明运用公共阳极可以实现多层晶片的良好键合。实验表明在温度为350℃~450℃,电压在为400 800V时,玻璃-铝-玻璃的键合质量较高。 Aluminum and glass anodic bonding process was researched in the paper. The experimental research show that high bonding quality of glass/aluminum/glass can be obtained at the temperature of 350 - 450℃ and voltage of 400 - 480V.
出处 《铝加工》 CAS 2012年第4期4-8,共5页 Aluminium Fabrication
基金 太原市科技局大学生创新创业专项基金 项目编号:20111067
关键词 静电键合 玻璃 公共阳极 electrostatic bonding glass aluminum public anode
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