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Fabrication of Ti ohmic contact to n-type 6H-SiC without high-temperature annealing

Fabrication of Ti ohmic contact to n-type 6H-SiC without high-temperature annealing
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摘要 The effect of surface morphology of 6H-SiC substrate on the ohmic contact properties of Ti/6H-SiC structure is studied. The H-terminated surface on Si-face 6H-SiC is obtained by both dipping SiC into HF acid solution for 15 s and thermal heating SiC in hydrogen atmosphere at 1100 ℃ for 10 min, while the H-terminated surface on C-face 6H-SiC could be obtained only by the latter method. Ti is deposited on Si-face and C-face SiC substrates with H-terminated surfaces and ohmic contact is obtained without high-temperature annealing. The effect of surface morphology of 6H-SiC substrate on the ohmic contact properties of Ti/6H-SiC structure is studied. The H-terminated surface on Si-face 6H-SiC is obtained by both dipping SiC into HF acid solution for 15 s and thermal heating SiC in hydrogen atmosphere at 1100 ℃ for 10 min, while the H-terminated surface on C-face 6H-SiC could be obtained only by the latter method. Ti is deposited on Si-face and C-face SiC substrates with H-terminated surfaces and ohmic contact is obtained without high-temperature annealing.
出处 《Chinese Physics B》 SCIE EI CAS CSCD 2012年第9期410-413,共4页 中国物理B(英文版)
基金 Project supported by the Innovation Program of the Chinese Academy of Sciences (Grant No. KJCX2-EW-W10) the Shanghai Municipal Science and Technology Commission, China (Grant Nos. 09DZ1141400 and 09520714900) the Young Scientists Fund of the National Natural Science Foundation of China (Grant No. 51002176)
关键词 Ti contact 6H-SIC HF acid H2 treatment Ti contact, 6H-SiC, HF acid, H2 treatment
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