高密度微型主板电源模块热应力分析

Thermal Stress Analysis of High-density Power Supply Module on Micro-motherboard

电源模块以其功率密度大、转换效率高及可靠性好等优点,在机载电脑、航空电子及医疗器械等领域得到广泛应用,成为未来微型主板设计的发展趋势,因此成为国内外电子产品研究的焦点之一。采用英特尔凌动处理器N270为核心的主板设计,将主板上电源部分设计成一个高密度模块,运用有限元分析软件ANSYS建立该电源模块的三维模型。对该模块在工作模式下封装体温度场分布以及由温度引起的应力分布情况进行了模拟。通过热分析,对电源模块进行设计获得最佳设计方案。

This paper uses the motherboard design which the core chip CPU is the series N270 of the Intel Atom,have the power part of the motherboard designed a high-density module,and build the three-dimensional model of the power supply module in the environment of the finite element analysis software that is named of ANSYS.This paper simulates the temperature distribution and the stress caused by the temperature distribution of the packaging in the operating mode.Thermal Analysis of the power module optimized to achieve the best design.