摘要
根据温度恒定时输入热量与输出热量相等的原理,提出了一种简单方便的测量热沉散热功率的方法,并搭建了实验台。通过测量输入电热丝中的电压、电流以及通电时间即可得到热沉的散热功率,并通过数理分析确定实验测量周期,以保证实验结果误差在5%以内。实验表明在热沉翅片根部开孔可以有效提高热沉散热功率,对测试所用热沉而言最高可提高16.3%。但随着开孔数量的增多,热沉的散热功率先上升达到一个极值后再下降。究其原因在于开孔增多的同时,减少了热沉内部热量自热沉底部向热沉顶部传递的面积,增加了热沉内部的传热阻力。
Based on the principle that the heat output is equal to the heat input when the temperature is constant, a measure method of the heat sink cooling power was proposed, and a test platform was built. The heat sink cooling power was obtained by measuring the voltage, current and power-on time of the input heating wire. Test period could be determined by mathematical analysis, so as the error can be controlled within 5%. Experimental results show that the cooling power can be effectively improved by opening holes at the heat sink fin root, and the maximum increase can reach 16. 3%. But with the number increase of the holes, heat dissipation first increases to an extreme and then decreases. The reason is that more holes will reduce the internal heat transfer area from the bottom to the top of the heat sink as well as increase the heat transfer resistance inside the heat sink.
出处
《半导体光电》
CAS
CSCD
北大核心
2012年第4期520-523,528,共5页
Semiconductor Optoelectronics
关键词
热沉
散热功率
开孔
heat sink
heat dissipation power
opening holes