表面贴装过程仿真系统的研究与开发

Research and development of Simulation System for the Process of SMT

文章从表面贴装技术(SMT)现状及特点开始,介绍多品种小批量电子产品中使用表面贴装技术存在的问题。针对这一情况对表面贴装过程仿真系统的需求进行了分析,并详细论述了仿真系统的文件预处理、仿真以及数据库维护三大主要模块设计,主要介绍采用OpenGL实现仿真模块的方法,同时展示仿真系统实现结果。最后总结了仿真系统的特点。

Based on the description of the present situation and characteristics of Surface Mounted Technology （SMT）, this paper introduces the problems when SMT is applied to the multi-varieties and small-batch electronic product. So this paper analyzes the demand of the simulation system for the process of SMT, and describes the design of three main modules such as document preprocessing, simulation and database maintenance. It mainly introduces the implementation method of simulation module by using OpenGL, and shows the result of the simulation system at the same time. The characteristics of this simulation system are summarized at last.