细晶CuCr系触头材料的研究

A Research on Fine Grain CuCr Contact Material

研究了电弧熔炼法、激光表面重熔法和机械球磨粉末后热压烧结法制备的CuCr5 0触头材料。结果表明 ,三种方法获取的CuCr5 0材料中Cr颗粒均得到细化 ,远远小于原始尺寸 ,其中激光表面重熔法的Cr颗粒尺寸最小 ,为 3～ 5 μm ;从含氧量、硬度、电导率综合性能看 ,以激光表面重熔法最为适宜 ;在激光输出功率为 3 2kW时 ,材料的组织与性能最佳。

CuCr50 contact materials were prepared by three kind of processes,electrical arc melting, laser surface remelting and mechanical grinding powder then sintering. The microstructures and properties of the materials were also investigated. The results show that Cr grains were fined in the CuCr50 contact materials produced by above three methods. The size of Cr particles was much smaller than original ones, especially by laser surface remelting, the size of Cr particles is about 3～5 μm. In the view of oxygen contained, hardness and conductivity, laser surface remelting is the best way for producing fine grain contact materials. The best microstructure and properties can be abtained when the laser output is 3.2kW.