固体装药结构界面应力分析

Interface stress analysis of solid motor grain structure

研究了基于热黏弹性接触理论计算固体装药结构界面应力的数值方法,给出了一种快速判断界面是否脱黏的工程实用方法.以某固体装药结构为例,采用接触算法模拟固体装药多层结构复杂的边界条件,计算了挂飞工况下固体装药结构应变场特征,研究了壳体/绝热层界面应力的分布规律,结果表明:应变场云图符合工程实际,壳体/绝热层界面黏接良好,不会发生脱黏现象.

The numerical method based on thermal viscoelastic contact theory was studied. It provided a convenient method to judge whether interface debond occured or not. A solid motor grain structure was taken as an example, and contact arithmetic was applied to simulate multilayer complicated boundary of solid motor grain structure. Strain field was computed under flight condition, and distribution rule of interface stress between case and insulation was researched. Results show that strain field contour agrees with the fact. Interface between case and insulation is ideal and is unable to debond.