摘要
采用两种具有代表意义的KIC测试方法 ,对两类试验材料 (0Y ZrO2 /MoSi2 基复合材料和2 5Y ZrO2 /MoSi2 基复合材料 )的断裂韧度进行了对比和分析 ,探讨了两类ZrO2 增韧机制所伴随的两类显微结构对断裂韧度测试方法的不同响应关系和内在作用机制。
The comparison of the evaluation methods for the facture toughness of the test materials indicated that the obvious difference is present between the K IM (IM) and K IC (SENB)for the same test material under the same test condition. The K IC (IM) of the 0Y ZrO 2/MoSi 2 matrix composites were obviously higher than that of the 2 5Y ZrO 2/MoSi 2 matrix composites. the K IC (SENB)of the 0Y ZrO 2/MoSi 2 matrix composites were remarkably lower than that of the 2 5Y ZrO 2/MoSi 2 matrix composites.
关键词
MOSI2
ZRO2
复合材料
断裂韧度
测试方法
MoSi_2
ZrO_2
hot pressing composite
microstructure
fracture toughness
toughening mechanism