摘要
针对不同应用的热敏MEMS器件的界面电路设计高性能放大器,提出建立与CMOS工艺兼容的热敏MEMS器件前置放大器的IP库的概念。通过提取相关热敏器件的典型参数,设计低功耗、低噪声且分别符合精度和速度等特殊要求的前置放大器,对3种不同结构的放大器进行分析研究,并利用Cadence软件,基于CSMC 0.5μm标准CMOS工艺库进行设计仿真。仿真结果表明:3种不同结构的放大器可以用于相应性能要求的热敏MEMS器件中。
Aiming at various application interface circuits of MEMS thermal sensors, high performance preamplifiers is designed. The concept of setting up IP library of pre-amplifiers for CMOS-process-compatible MEMS thermal sensors is proposed. By extracting related devices typical parameters, pre-amplifiers which is low-power, low-noise and meet special requirements such as precision and speed are designed. Three different structures of amplifiers are analyzed based on CSMC 0.5 μm CMOS standard process library are designed and simulated by Cadence software. Simulation results show that three different structures amplifier can be used in MEMS thermal sensors for relevant performance requirements.
出处
《传感器与微系统》
CSCD
北大核心
2012年第9期75-78,82,共5页
Transducer and Microsystem Technologies
基金
国家科技重大专项基金资助项目(2011ZX02507)
