新型耐高温有机硅树脂的制备及其性能研究

Study on preparation and properties of new type organic-silicone with high temperature-resistance

以甲基三甲氧基硅烷/苯基三甲氧基硅烷为混合硅烷,在硅烷偶联剂(KH-560)作用下混合硅烷经水解缩合后,制得耐高温有机硅树脂。研究结果表明:该硅树脂在N2中失重10%时的温度为385℃,说明其耐热性较好;胶接件的剪切强度随甲基三甲氧基硅烷比例增加而增大;基材表面经KH-560处理后,相应硅树脂/基材胶接件的剪切强度随KH-560含量增加而增大,并且基材为钢片、铝片和玻璃钢片时的剪切强度分别为1.7、1.6、2.3 MPa。

With methyl trimethoxysilane/phenyl trimethoxysilane as mixed silane,an organic-silicone with high temperature-resistance was prepared by hydrolysis and polycondensation of mixed silane under action of silane coupler（KH-560）. The research results show6d that the silicone had better heat-resistance because its 10% weight loss temperature was 385℃ in N2. The shear strength of bonded sample was increased with increasing methyl trimethoxysilane proportion. The shear strength of bonded sample made from silicone and substrate was increased with increasing KH-560 contents when the substrate surface was treated by KH-560,and the shear strengths of bonded sample were 1.7,1.6,2.3 MPa respectively when the substrates were steel,aluminium,glass fiber reinforced plastic （GFRP） respectively.