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芯片量产测试接口板的电介质材料选择

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摘要 高速的芯片量产测试接口板需要解决好电源和信号完整性问题,本文依据信号在ate测试机台走向针对通孔,传输线,电源平面对高速测试接口板的设计最几点探讨。
作者 韩雷
出处 《数字技术与应用》 2012年第8期179-181,共3页 Digital Technology & Application
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参考文献5

  • 1Masashi Shimanouchi " New Paradigm for Signal Paths in ATE Pin Electronics are Needed for Serialcom Device Testing," Proceedings of the International Test Conference 2002.
  • 2Jose Moreira et al "PCB Loadboard Design Challenges for Multi-Gigabit Devices in Automated Test Applications," IEC DesignCon 2006.
  • 3Jose Moreira et al "Beyound lOGb/s? Challenges of Characterizing Future I/O Interfaces with Automated Test Equipment," IEEE International Test Conference 2008.
  • 4Lee W. Ritchey, "A Survey and Tutorial of Dielectric Materials used in the Manufacture of Printed Circuit Boards," Circuitree magazine, November 1999.
  • 5H. A. Wheeler, "Transmission Line Properties of a Stripline between Parallel Planes," IEEE Trans. Microwave theory and Techniques, Vol. MTT-26, November, 1978, pp. 866-876.

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