新健胃包芯片一步制粒工艺优化

Optimization of One-step Granulation Technology for Xinjianwei Package Tablet

目的:优选新健胃包芯片一步制粒工艺。方法:以颗粒软硬度、性状、粒径大小、可压性及片芯中碳酸氢钠含量为考察指标,采用单因素试验对影响制粒的各关键因素进行考察。结果:新健胃包芯片制粒工艺在不改变原辅料,物料温度45℃,进风温度在50～60℃,5%淀粉浆为黏合剂的条件下,制备的颗粒可压性、流动性均较好,压制的包芯片稳定,且提高了碳酸氢钠含量。结论:该颗粒采用一步制粒法生产可操作性强,产品质量稳定提高,可为大生产提供技术参考。

Objective： To optimize one-step granulation technology for Xinjianwei package tablet. Method： With particle hardness, particle size, compressibility, properties and the content of sodium bicarbonate in tablet core as indexes, single-factors test was used to investigate key factors on granulation technology for Xinjianwei package tablet. Result： Granulation technology of Xinjianwei package tablet didn＇t change original materials, material temperature was 45 ℃, inlet air temperature was 50-60 ℃ , 5% starch slurry as adhesive, under these conditions, prepared particle had excellent compressibility and mobility, package tablet was stability, and the content of sodium bicarbonate had been raised. Conclusion： One-step granulation had very excellent operability, quality of products was stability and was improved, it could provided reference for mass production.