摘要
随着集成电路封装技术的发展,BGA封装得到了广泛应用,而其焊点可靠性是现代电子封装技术的重要课题。该文介绍了BGA焊点可靠性分析的主要方法,同时对影响焊点可靠性的各因素进行综合分析。并对BGA焊点可靠性发展的前景进行了初步展望。
With the development of IC packaging technology,BGA is widely used,the reliability of its sol- der joints has became an important subject of modern electronic packaging technology.In this paper,a common method to analysis the reliability of BGA solder joints is introduced,various parameters which were displayed and the factors of influence on the solder joints,reliability were analyzed simultaneity. Based on above,we have an expectation of development foreground of the reliability of BGA solder joints.
出处
《电子质量》
2012年第9期22-27,共6页
Electronics Quality
关键词
有限元
焊点
可靠性
BGA
finite element
solder joint
reliability
BGA
