摘要
回顾了羟基乙叉二膦酸电解液镀铜在国内的研究和生产应用概况。研讨了羟基乙叉二膦酸镀铜工艺的络合和电析机理。讨论了镀液与镀层的性能以及工艺操作条件与维护方法,并与氰化镀铜工艺作了比较。结果表明,加入CuR-1添加剂的羟基乙叉二膦酸镀铜工艺作为替代氰化镀铜是很有发展前途的无氰碱性镀铜新工艺。
The study and industry application of electroplating copper from HEDP ( 1-hydroxyethylidene- 1,1- diphosphonic acid)bath in china has been reviewed and discussed. The coordination and electrodepo- sition machanism of copper from Cu-HEDP bath and the propenties of the bath solution and plate were described and compared with Cu-cyanide process. The operation condition and method for maintanance of the process were also discussed. The results show that the Cu- HEDP process ( especially, having CuR- 1 additive) is the preferred process in replace of Cu-cyanide process.
出处
《电镀与精饰》
CAS
北大核心
2012年第9期12-16,共5页
Plating & Finishing
关键词
无氰镀铜
羟基乙叉二膦酸
镀铜络合剂
添加剂
cyanide- free copper plating
1 - hydroxyethylidene- 1,1 - diphosphonic acid
copper comple- xing agent
addition agent