环氧模塑封装材料的疲劳性能研究

Study on Fatigue Performance of Epoxy Molding Compound

采用疲劳实验系统对环氧模塑封装材料(EMC)的热机械疲劳性能进行了测试,并采用扫描电子显微镜(SEM)对疲劳断口进行了分析。结果表明,实验温度越高,试样所承受的应力水平越大,其疲劳寿命就越低;实验温度较低时,EMC在疲劳失效前没有出现应变突然增加的现象,随着实验温度的升高,一定循环内应变幅值增加得较快,而且单一循环内,温度越高应变幅值增加越大,疲劳失效也越快;EMC的疲劳断口分析表明,硅颗粒与环氧基质间的分层、环氧基质间的开裂、硅颗粒本身的开裂是其疲劳失效的主要形式,其中,高温情况下的最主要疲劳失效为硅颗粒与环氧基质间的分层。

Thermo-mechanical fatigue performance of epoxy molding compound （ EMC ） was studied through fatigue testing system, and the fatigue fracture was observed by SEM.The results showed that temperature and stress level beared by specimens were higher, fatigue life of specimens was lowered.At lower experimental temperature, a sudden strain increase did not appear before fatigue damage.With experimental temperature increased, strain amplitude increased faster within a certain cycle, and in a single cycle, strain amplitude increased greater and fatigue failured faster with higher temperature.The fatigue fracture appearance analysis of EMC showed that layering between silicon particle and epoxy matrix, epoxy matrix cracking and silicon particle cracking were the main form of fatigue failure.The main fatigue failure under high temperature was layering between silicon particle and epoxy matrix.