超声龈上洁治术前应用半导体激光镇痛的效果评价

Evaluation of analgesic effect of semiconductor laser on supragingival scaling

目的评价超声龈上洁治术前应用半导体激光进行镇痛的效果。方法选择需进行超声龈上洁治术的牙龈炎患者50例。在同一患者口内选取左下中切牙作为实验牙,对侧同名牙作为对照牙。实验组使用半导体激光照射洁治区龈缘处3min后即刻超声龈上洁治;对照组常规进行超声龈上洁治。采用视觉模拟量表(VAS)记录两侧VAS值并评价镇痛效果。结果实验组龈上超声洁治的疼痛评分明显低于对照组,差异有统计学意义(P<0.05)。结论术前应用半导体激光照射患牙,可在超声龈上洁治术中起到明显的镇痛作用。

Objective To evaluate the analgesic effect of semiconductor laser on ultrasonic supragingival scaling. Methods A total of 50 patients were included in this clinical trial. One lower incisor was radiated by semiconductor laser for three minutes before scaling, and the contralateral lower incisor served as control without radiation. Then the scaling was performed in these two incisors and a visual analog scale （VAS） used to record the VAS values of both sides. The analgesic effect of the laser was evaluated. Results The VAS values of the laser group were significantly lower than those of the control group （ P 〈 0. 05 ）. Conclusion The semiconductor laser can significantly reduce pain in the supragingival scaling.