高速高密度PCB电源完整性分析

Power Integrity Analysis of High-Speed and High-Density PCB

随着集成电路开关速度的提高以及PCB密度的增加,电源完整性分析已成为高速PCB设计中不可忽略的问题。针对电源完整性问题产生的原因和解决方法,以一个8层高密度数模混合PCB为例,采用Ansoft SIwave仿真软件,对多层高速PCB的电源完整性进行了详尽的分析,并提出了优化电源分配网络PDN的设计。仿真结果表明:添加去耦电容后的PDN设计满足了设计需要。

With more rapidly switching of IC and higher density of PCB （Printed Circuit Board）, power integrity has become a serious problem which can not be neglected in the design of PCB. Based on the causation of power integrity,the Power Distribution Networks （PDN） of a high-density 8 layers PCB is analyzed and optimized by Ansoft Slwave. The simulation results show that the modified PDN is much better than before with adding the decoupling capacitor, and satisfies the whole design need.