摘要
研究了聚四氟乙烯(PTFE)、聚酰亚胺薄膜(PI)、聚丙烯层压纸(PPLP)3种聚合物薄膜经液氮浸泡和冷热循环后在拉伸状态下的电气绝缘强度,并与未处理的样品进行对比。结果表明:未处理时,PI薄膜的工频绝缘强度最大;经液氮浸泡后,PTFE和PI薄膜的工频绝缘强度相当,而PPLP薄膜的工频绝缘强度相对稳定。
The electrical insulation strength of three types of polymer films,polytetrafluoroethylene(PTFE),polyimide(PI) and polypropylene laminate(PPLP),which were under tensile condition and after immersed in liquid nitrogen and thermocycling,was studied,and then was compared with that of untreated samples.The results show that the insulation strength of untreated PI film at power frequency is the largest.The insulation strength of the PTFE is equivalent to that of the PI after immersed in liquid nitrogen.The insulation strength of the PPLP is relatively stable.
出处
《绝缘材料》
CAS
北大核心
2012年第4期53-54,59,共3页
Insulating Materials
基金
国家高技术研究发展计划(863)项目(2009AA03Z209)
关键词
绝缘强度
聚合物薄膜
拉伸状态
insulation strength; polymer film; tensile condition