摘要
采用金相、扫描电镜、能谱等分析手段,对陶瓷-金属封接的严重缺陷——瓷件"光板"的产生原因进行了分析、探讨,并提出防止光板缺陷的措施。结果表明:焊料向金属化层的严重渗透以及金属化层玻璃相的缺少,均是导致光板的主要原因。通过改进金属化工艺,保证致密的金属化层显微结构,防止焊料渗透,可以避免光板缺陷。
Defects of Ceramic Metallization were analyzed by metallographic analysis, Scanning Elec- tron Microscopy and energy dispersive X-ray spectrometer methods in this paper, and methods of avoiding no adhesive ceramic were given. The results showed that braze infiltrate into metalizing and glassy reduced are both the main reasons caused no adhesive ceramic. Though improving metalizing process, compact microstructure of metalizing and preventing metalizing penetrated by braze could avoid status of no adhesive ceramics.
出处
《真空电子技术》
2012年第4期28-33,共6页
Vacuum Electronics
关键词
金属化
活化钼锰法
光板
显微结构
Metallizing, Moly-manganese, No adhesive ceramic, Microstrueture
