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动态DSC法研究BMI改性酚醛树脂固化反应动力学 被引量:4

Study on curing reaction kinetics of a bismaleimide modified phenolic resin by non-isothermal DSC
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摘要 采用非等温DSC(差示扫描量热)法研究BMI(双马来酰亚胺)改性PF(酚醛树脂)体系的固化动力学,借助升温速率-温度(β-T)外推法和红外光谱(FT-IR)跟踪固化反应过程,确定了BAN(BMI改性PF)体系的固化工艺和固化动力学参数。结果表明:BAN的固化工艺为"120℃/2 h→140℃/2 h→160℃/2 h→180℃/2 h",后处理工艺为220℃/3 h,BAN固化体系的动力学参数是表观活化能Ea=123.4 kJ/mol、频率因子A=1.96×1012s-1和反应级数n=1.05;根据n级动力学反应模型求解出该树脂的反应动力学方程,其计算值与试验值基本吻合,说明该模型能较好描述BAN的固化反应过程。 The curing kinetics of BMI(bismaleimide) modified PF(phenolic resin) system was investigated by non-isothermal DSC (differential scanning calorimetry). The curing technology and curing kinetic parameters of BAN(BMI modified PF) system were determined by heating speed-temperature(β-T) extrapolation and infrared spectroscopy(FT-IR) tracking curing reaction process. The results showed that the curing technology was "120 ℃/2h - 140℃/2 h-160℃/2 h--180 ℃/2 h" ,post-processing technology was 220℃/3 h,kinetic parameters such as apparent activation energy (E.) ,frequency factor(A ) and reaction order(n) were 123.4 kJ/mol, 1.96×10^12 s-1 and 1.05 respectively for BAN curing system. The model could better describe curing reaction process of BAN because its calculated values and experimental values were consistent when the reaction kinetics equation was calculated by n-order kinetic reaction model for BAN.
出处 《中国胶粘剂》 CAS 北大核心 2012年第9期5-8,共4页 China Adhesives
关键词 双马来酰亚胺 改性 酚醛树脂 动力学 n级固化模型 bismaleimide (BMI) modified phenolic resin (PF) kinetics n-order curing model
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二级参考文献32

共引文献40

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