期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

微细塑性铣削单晶硅实验研究 被引量：5

Experimental study on the ductile-mode micro milling of single crystalline silicon
下载PDF
导出
摘要 为了深入探讨塑性铣削单晶硅的切削机理,对单晶硅进行了微细铣削实验研究.结果表明,合理地设定铣削参数与保证特定的铣削环境都很重要,在这个前提下,可以实现塑性切削,在单晶硅上获得具有完整几何外形的特征,同时表面质量可以达到单纳米级别. Aiming at discovering the ductile-mode milling mechanism for single crystalline silicon, experimental study on micro milling is processed. The results show that it has the same significance for reasonable setting of micro milling parameters and cutting environment. Under this circumstance, ductile-mode machining can be achieved to obtain integral geometrical features and single nano-level surface quality on single crystalline silicon.
作者 程祥 高斌 杨先海 刘军营 田忠强
机构地区 山东理工大学机械工程学院 温州职业技术学院机械工程系
出处 《山东理工大学学报（自然科学版）》 CAS 2012年第4期53-55,60,共4页 Journal of Shandong University of Technology:Natural Science Edition
基金 山东省自然科学基金资助项目(ZR2011EEM010) 山东理工大学青年教师发展支持计划
关键词 微细加工 微细铣削 塑性切削 单晶硅 micro machining micro milling ductile-mode machining single crystalline silicon
分类号 TH161 [机械工程—机械制造及自动化]
  • 相关文献

参考文献7

  • 1Cheng X,Nakamoto K, Sugai M, et ai. Development of ultra-precision machining system with unique wire EDM tool fabrica-tion system for micro/nano-machining [J]. CIRP Annals, 2008,57(1) : 415-420.
  • 2Chen M J , Zhao Q L, et al. The critical conditions of brittleductile transition and the factors influencing the surface qualityof brittle materials in ultra precision grinding [J]. Journal ofMaterials Processing Technology, 2005,168(1) : 75-82.
  • 3Blackey W S,Scattergood R (). Ductile regime machining modelfor diamond turning of brittle materials [J]. Precision Engineer-ing, 1991,13(2) : 95-103.
  • 4姜峰,李剑峰,孙杰,李方义,路冬.硬脆材料塑性加工技术的研究现状[J].工具技术,2007,41(8):3-8. 被引量：21
  • 5Cheng X,Wang Z G, Nakamoto K,et al. Study on the microcustom PCD tooling for ductile-mode micro/nano machining ofsingle crystal silicon [C] // The 5th International Conference onMicro Manufacturing (ICOMM) and the InternationalConference on Multi-material Micro-manufacture( 4M).Wisconsin : 2010 : 5-8.
  • 6Cheng X,Wang Z G,Nakamoto K,et al. Design anddevelopment of micro polycrystalline ball end mill formicro/nano freeform machining of hard and brittle materials[J]. Journal of Micromechanics and Microengineering,2009 *19(11): 115-122.
  • 7Dornfeld D,Min S,Takeuchi Y. Recent advances in mechanicalmicromachining [J]. CIRP Annals, 2006,55(1): 745-768.

二级参考文献26

  • 1[1]T Nakasuji,S Kodera et al.Diamond turning of brittle materials for optical components.Annals of the CIRP,1990,39(1):89～92
  • 2[2]Peter N Blackey,Ronald O Scattergood.Ductile-regime machining of germanium and silicon.J.Am.Ceram.Soc.,1990,73(4):949～957
  • 3[3]B R Lawn,A G Evans.A model for crack initiation in elastic/plastic indentation fields.Journal of Materials Science,1977(12):2195～2199
  • 4[4]James Lankford,David L Davidson.The crack initiation threshold in ceramic materials subject to elastic/plastic indentation.Journal of Materials Science,1979(14):1662～1668
  • 5[5]W S Blackey,R O Scattergood.Ductile-regime machining model for diamond turning of brittle materials.Precision Engineering,1991,13(2):95～103
  • 6[6]T G Bifano,T A Dow,R O Scattergood.Ductile-regime grinding:a new technology for machining brittle materials.Transactions of the ASME:Journal of Engineering for Industry,1991(113):184～18
  • 7[7]K E Putick,A Franks.The physics of ductile-brittle machining transitions:single-point theory and experiment.精密工学会志,1990,56(5):788～790
  • 8[8]Mingjun Chen,Qingliang,Zhao et al.The critical conditions of brittle-ductile transition and the factors influencing the surface quality of brittle materials in ultra-precision grinding.Journal of Materials Processing Technology,2005,168:75～72
  • 9[9]Y Namba,M Saeki.Optical surface generation of organic nonlinear crystals by single-point diamond turning.Annals of the CIRP,2003,52(1):475～478
  • 10[10]Toyoshiro Inamura,Shoichi Shimada et al.Brittle/ductile transition phenomena observed in computer simulation of machining defect-free monocrystalline silicon.Annals of the CIRP,1997,46(1):31～34

共引文献20

同被引文献27

  • 1李成锋.介观尺度铣削力与表面形貌建模及工艺优化研究[D].上海:上海交通大学,2007.
  • 2Dornfeld D, Takeuchi Y. Reeent Advances in Me- chanical Micro Machining[J].Annals of the CIRP, 2006,55(2) .- 746-748.
  • 3Bissacco G, Hansen H N, Slunsky J. Modelling the Cutting Edge Radius Size Effect for Force Prediction in Micro Milling[J]. Annals of the CIRP, 2008,57 (1) ..113-116.
  • 4Vivancos J, Luis C J, Costa L, et al. Optimal Mac-hing Parameters Selection in High Speed Milling of Hundened Steels for Injection Moulds[J]. Journal of Materials Processing Technology, 2004, 155/156 (30) .. 1505-1512.
  • 5Son S M, Lira H S, Ahn J H. Effects of the Fric- tion Coefficient on the Minimum Cutting Thickness in Micro Cutting[J]. International Journal of Ma chine ToolsManufaeture,2005,45(4/5) : 529-535.
  • 6Palanisamy P, Rajendran 1, Shenmugasundaram S. Optimization of Machining Parameters Using Ge netic Algorithm and Experimental Validation for end Milling Operations [J]. Int. J. Adv. Manuf. Technol., 2007,32 (7) : 644-655.
  • 7Rusnaldy,Tae Jo Ko,Hee Sool Kim.Micro-end-milling of single-crystal silicon[J].International Journal of Machine Tools & Manufacture,2007,47(14):2111-2119.
  • 8Abdel-Aal H A,Patten J A,Dong L.On the thermal aspects ofductile regime micro-scratching of single crystal silicon for NEMS/MEMS applications[J].Wear,2005,259 (7) 1343-1351.
  • 9Arefin S,Li X P,Rahman M,et al.The upper bound of tool edgeradius for nanoseale ductile mode cutting of silicon wafer[J].International Journal of Advanced Manufacturing Technology,2007,31 (7):655-662.
  • 10Chang CK,Lu HS.Design optimization of cutting parameters for side milling operations with multiple performance characteristics[J].International Journal of Advanced Manufacturing Technology,2007,32(5):18-26.

引证文献5

二级引证文献18

山东理工大学学报（自然科学版）
2012年 第4期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部