摘要
高层次、高厚径比板具有较高的附加值,现已成为我公司主要制作产品之一。文章主要是简述此类型板在我公司湿制程过程中出现的一些异于其它普通板的失效模式及其预防控制方式。
The high level,the high aspect ratio due to the thick plate is of high added value,has now become one of our main products are made.This paper mainly described in this type of wet process the board appeared in the process of some different from other common board failure modes and their prevention and control method.
出处
《印制电路信息》
2012年第9期24-28,52,共6页
Printed Circuit Information
关键词
高层次
高厚径比
湿制程
失效模式
预防控制
high level
high aspect ratio
wet process
failure modes
prevention and control