摘要
概述了化学镀镍/化学镀钯/浸金涂(镀)覆层的优点,它比起化学镀镍/浸金,不仅更适用于IC封装,而且提高了可靠性,降低了成本。
The paper describes that the superiority of ENEPIG in the surface finish.Compareed ENEPIG with the ENIG,it,it not only applicable to IC package,but also improves the reliability and decreases the cost.
出处
《印制电路信息》
2012年第9期57-59,共3页
Printed Circuit Information
