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Research on Microcrack Extension Mechanism of SiCp/Al in the Machining Process

Research on Microcrack Extension Mechanism of SiCp/Al in the Machining Process
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摘要 The generation and development of microcracks of SiCp/Al materials in the machining process were researched, and the forming causes and mechanism of the cut surface morphology for ap=0.2 mm or ap=0.4 mm and at 2 m/min~10 m/min were systematically analyzed. The supporting and "floor"roles of aluminum are wake at a shallower cutting depth and a lower speed, the SiC particles are shed under the role of cutting force, and the microcrack size of cut surface is larger. With the increase in the cutting depth and the cutting speed, the cutting temperature increases, the supporting and "floor" roles of aluminum are enhanced, the shedding and fracture of the reinforcement particles are flexible under the action of the cutting force, the fracture of cutting transforms from brittle to ductile, and the expansion of microcrack on the entire surface tends to balance with a smaller size. A curve between the cutting force and the cutting speed was plotted, a microcrack form of the cut surface was given, and some theoretical basis is provided for the mechanical processing and the surface quality. The generation and development of microcracks of SiCp/Al materials in the machining process were researched, and the forming causes and mechanism of the cut surface morphology for ap = 0. 2 mm or ap = 0.4 mm and at 2 m/rain 10 m/min were systematically analyzed. The supporting and " floor " roles of aluminum are wake at a shallower cutting depth and a lower speed, the SiC particles are shed under the role of cutting force, and the microcrack size of cut surface is larger. With the increase in the cutting depth and the cutting speed, the cutting temperature increases, the supporting and "floor" roles of aluminum are enhanced, the shedding and fracture of the reinforcement particles are flexible under the ac- tion of the cutting force, the fracture of cutting transforms from brittle to ductile, and the expansion of microcrack on the en- tire surface tends to balance with a smaller size. A curve between the cutting force and the cutting speed was plotted, a microcrack form of the cut surface was given, and some theoretical basis is provided for the mechanical processing and the surface quality.
出处 《Defence Technology(防务技术)》 SCIE EI CAS 2012年第3期181-187,共7页 Defence Technology
关键词 machinofature technique and EQUIPMENT SICP/AL MACHINING MICROCRACK MECHANISM machinofature technique and equipment SiCp/AI machining microcrack mechanism
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