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Material removal rate of 6H-SiC crystal substrate CMP using an alumina(Al_2O_3) abrasive 被引量:8

Material removal rate of 6H-SiC crystal substrate CMP using an alumina(Al_2O_3) abrasive
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摘要 The influences of the polishing slurry composition,such as the pH value,the abrasive size and its concentration,the dispersant and the oxidants,the rotational velocity of the polishing platen and the carrier and the polishing pressure,on the material removal rate of SiC crystal substrate(0001) Si and a(0001) C surface have been studied based on the alumina abrasive in chemical mechanical polishing(CMP).The results proposed by our research here will provide a reference for developing the slurry,optimizing the process parameters,and investigating the material removal mechanism in the CMP of SiC crystal substrate. The influences of the polishing slurry composition,such as the pH value,the abrasive size and its concentration,the dispersant and the oxidants,the rotational velocity of the polishing platen and the carrier and the polishing pressure,on the material removal rate of SiC crystal substrate(0001) Si and a(0001) C surface have been studied based on the alumina abrasive in chemical mechanical polishing(CMP).The results proposed by our research here will provide a reference for developing the slurry,optimizing the process parameters,and investigating the material removal mechanism in the CMP of SiC crystal substrate.
出处 《Journal of Semiconductors》 EI CAS CSCD 2012年第10期142-148,共7页 半导体学报(英文版)
基金 supported by the National Natural Science Foundation of China(No.51075125) the Key Scientific Research Program of Economic and Social Development of Xinxiang City(No.S10004) the Science and Technology Innovation Program of Henan Institute of Science and Technology
关键词 SiC crystal substrate alumina abrasive chemical mechanical polishing material removal rate polishing slurry SiC crystal substrate alumina abrasive chemical mechanical polishing material removal rate polishing slurry
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参考文献10

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