摘要
利用热重法研究了聚酰亚胺 (PI) /环氧树脂 (E -5 1 )共混胶粘剂的耐热性。结果表明 ,共混胶粘剂体系中 ,热降解峰温度范围是 2 5 0～ 40 0℃ ,当余重为 5 0 %时 ,温度介于 44 0～ 60 0℃之间。通过比较缩合型PI和加成型PI对环氧树脂耐热性的改善效果 ,发现自制的聚酰胺酸 (PAA)的改性效果要比双马来酰亚胺(BMI)好。
The heat resistant property of polyimide/epoxy blending adhesive was studied by means of thermogravimetry(TG).The result show that blending adhesives' thermal property is good.Its thermal degration temperature is at the range of 440～600 ℃.Comparing two kinds of polyimides' influence on thermal properties of E 51 resin,it is found that the modified effect of polyamide acid is better than that of bismaleimide.
出处
《粘接》
CAS
2000年第4期7-9,共3页
Adhesion
