摘要
综述了对半导体集成电路发展有深刻影响的微电子封装技术的现状 ,指出了适用于高密度封装的载带封装 (TCP)、球栅阵列封装 (BGA)、倒装片 (FCT)、芯片规模封装 (CSP)、多芯片组件 (MCM)。
The present situation of microelectronic packaging technology that have deeply influence on development of semiconductor IC is described.Also the key technologies such as TCP、BGA、FC、CSP、MCM、3D packaging etc.Which are used for high-density packaging and its future is pointed out.
出处
《电子工业专用设备》
2000年第2期1-9,共9页
Equipment for Electronic Products Manufacturing
