摘要
随着印制电路板的发展 ,液态感光阻焊膜工艺逐渐成为电路板工业的阻焊膜加工主导方法。从生产应用的角度 ,对该种加工工艺 (丝网印刷涂覆型 )的每一个步骤的加工方法及其质量控制进行了详细的阐述。
With the development of Printed Circuit Board (PCB),technology of Liquid Photo-imageable Solder Masks(LPSM) had become the prime process technology in industry of PCB.Every process and quality control of this technology (Screen Printing for coating) are describled.
出处
《电子工艺技术》
2000年第4期147-152,共6页
Electronics Process Technology
关键词
印制电路板
液态感光阻焊工艺
丝印涂覆
Printed Circuit Board
Liquid Photo-imageable Solder Masks(LPSM)
Screen Printing for coating
Process technology
