期刊文献+

一种扩展蘑菇型EBG结构阻带带宽的新方法 被引量:8

Novel Method to Broaden the Stop-band Width of the Mushroom-like Electromagnetic Band Gap Structure
下载PDF
导出
摘要 该文根据蘑菇型电磁带隙(EBG)结构的等效电路原理提出一种插入交指电容的方法,实现扩宽蘑菇型EBG结构阻带宽度,并设计一种T型交指电容EBG结构验证该方法的有效性。-30 dB时该结构相对于蘑菇型EBG结构,阻带下截止频率从0.9 GHz降到290 MHz,带宽从6.1 GHz提高到7.1 GHz。在不改变EBG结构单元面积,并增加交指单元层数和降低单元厚度的情况下,通过仿真验证该方法可有效提高抑制同步开关噪声的能力。 According to the equivalent circuit of the mushroom^like Electromagnetic Band Gap (EBG) structure, a novel method of inserting the Inter-Digital Capacitor (IDC) to broaden the bandwidth of the stop-band is proposed in this paper. The T-shaped IDC EBG structure is designed to prove the correction and validity of the method. Compared with the mushroom-like EBG, the -30 dB stop-band of the proposed structure is broadened from 6.1 GHz to 7.1 GHz and the lower corner frequency is decreased from 0.9 GHz to 0.29 GHz. It is implemented by increasing the number of planes of IDC and decreasing the thickness of cell without changing the area of EBG cell. The results of the simulation show that the presented TIDC EBG is fit for Simultaneous Switching Noise (SSN) suppression.
出处 《电子与信息学报》 EI CSCD 北大核心 2012年第10期2537-2540,共4页 Journal of Electronics & Information Technology
基金 国家自然科学基金(60876023) 重点实验室基金资助课题
关键词 电磁带隙 电源完整性 同步开关噪声 阻带 交指电容 Electromagnetic Band Gap (EBG) Power integrity Simultaneous Switching Noise (SSN) Stop-band Inter-Digital Capacitor (IDC)
  • 相关文献

参考文献14

  • 1Jong Hwa Kwon, Dong Uk Sim, Sang Il Kwak, et al.. Novel electromagnetic bandgap array structure on power distribution network for suppressing simultaneous switching noise and minimizing effects on high-speed signals[J]. IEEE Transactions on Electromagnetic Compatibility, 2010, 52(2): 365-372.
  • 2Kim Yong-ju, Yoon Han-sub, Lee Seong-soo, et al.. An efficient path-based equivalent circuit model for design, synthesis, and optimization of power distribution networks in multilayer printed circuit boards[J]. IEEE Transactions on Advanced Packaging, 2004, 27(1): 97-106.
  • 3Prathap Muthana, Krishna Srinivasan, Arif Ege Engin, et al.. Improvements in noise suppression for I/O circuits using embedded planar capacitors[J]. IEEE Transactions on Advanced Packaging, 2008, 31(2): 234-245.
  • 4Wu Chun-te, Shiue Guang-hwa, Lin Sheng-mou, et al.. Composite effects of reflections and ground bounce for signal line through a split power plane[J]. IEEE Transactions on Advanced Packaging, 2002, 25(2): 297-301.
  • 5Abhari R, Eleftheriades G V, and Deventer-Perkins E V. Analysis of differential vias in a multilayer parallel plate environment using a physics-based CAD model[C]. IEEE International Microwave Symposium Digest, Phoenix, AZ, USA, May 2001: 2031-2034.
  • 6Siveenpiper D, Zhang Li-jun, Jimenez Broas R F, et al.. High-impedance electromagnetic surfaces with a forbidden frequency band[J]. IEEE Transactions on Microwave Theory and Techniques, 1999, 47(11): 2059-2074.
  • 7丁同浩,李玉山,张伟,闫旭,曲咏哲.电磁带隙结构的信号完整性分析[J].电子与信息学报,2010,32(5):1267-1270. 被引量:7
  • 8He Y, Li L, Liang C H, et al.. Leafy EBG structures for ultra-wideband SSN suppression in power/ground plane pairs[J]. Electronics Letters, 2010, 46(11): 768-769.
  • 9史凌峰,侯斌.一种适用于高速电路中SSN抑制的紧凑型电磁带隙新结构[J].电子与信息学报,2011,33(9):2283-2286. 被引量:3
  • 10He Yan, Liang Chang-hong, and Liu Qing-huo. Novel array EBG structures for ultrawideband simultaneous switching noise suppression[J]. IEEE Antennas and Wireless Propagation Letters, 2011, 10: 588-591.

二级参考文献24

  • 1丁让箭,吴琼,吴先良.一种新型微带光子带隙结构[J].电波科学学报,2006,21(3):437-440. 被引量:1
  • 2Joo S H,Kim D Y,and Lee H Y.S-bridged inductive electromagnetic bandgap power plane for suppression of ground bounce noise.IEEE Microwave and Wireless Components Letters,2007,17(10):487-489.
  • 3Shahparnia S and Ramahi M O.Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using Electromagnetic bandgap structures.IEEE Transactions on Electromagnetic Compatibility,2004,46(4):580-586.
  • 4Sabbagh M A E and Mansour R R.Ultra-wide suppression band of surface waves using periodic microstrip-based structures.IEEE Transactions on Microwave Theory and Techniques,2008,56(3):671-683.
  • 5Abhari R and Eleftheriades G V.Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuit.IEEE Transactions on Microwave Theory and Techniques,2003,51(6):1629-1639.
  • 6Kim K H and Schutt A J E.Analysis and modeling of hybrid plannar-type electromagnetic-bandgap structures and feasibility study on power distribution network application.IEEE Transactions on Microwave Theory and Techniques,2008,56(1):178-186.
  • 7Park J,Lu A C W,Chua K M,Wai L L,Lee J,and Kim J.Double-stacked EBG structure for wideband suppression of simultaneous switching noise in LTCC-based SiP application.IEEE Microwave and Wireless Components Letter,2006,16(9):481-483.
  • 8Sievenpiper D,Zhang L,Broas R F J,Alexopolous N G A,and Yablonovitch E.High-impedance electromagnetic surfaces with a forbidden frequency band.IEEE Transactions on Microwave Theory and Techniques,1999,47(11):2059-2073.
  • 9Qin J O,Ramahi M,and Granatstein V.Novel planar electromagnetic bandgap structures for mitigation of switching noise and EMI reduction in high-speed circuits.IEEE Transactions on Electromagnetic Compatibility,2007,49(3):661-669.
  • 10Wu T L,Lin Y Y,Wang C C,and Chen S T.Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits.IEEE Transactions on Microwave Theory and Techniques,2005,53(9):2935-2942.

共引文献8

同被引文献51

  • 1郑秋容,袁乃昌,付云起.紧凑型电磁带隙结构在短路微带天线中的应用[J].电子与信息学报,2007,29(6):1500-1502. 被引量:15
  • 2WU TZONG-LIN,CHUANG HAO-HSIANG,WANG Tingkuang.Overview of Power Integrity Solutions on Package and PCB:Decoupling and EBG Isolation[J].IEEE Transactions on Electromagnetic Compatibility,2010,52(2):346-356.
  • 3ZAW ZAW OO,LIU Xiaoen,WEI Xingchang.Analysis of SMT Decoupling Capacitor Placement in Electronic Packages Using Hybrid Modeling Method[C]//IEEE International Symposium on Integrated Circuits.Singapore:IEEE,2009:627-630.
  • 4ZHU Haoran,LI Jianjie,MAO Junfa.Ultra-Sideband Suppression of SSN Using Localized Topology with Csrrs and Embedded Capacitance in High-Speed Circuits[J].IEEE Transactions on Microwave Theory and Techniques,2013,61(2):764-772.
  • 5WU Chunte,SHIUE GUANGKHWA,LIN Shengmo,et al.Composite Effects of Reflections and Ground Bounce for Signal Line through a Split Power Plane[J].IEEE Transactions on Advanced Packaging,2002,25(2):297-301.
  • 6WU TZONG-LIN,WANG CHIEN-CHUNG,LIN Yinhui,et al.A Novel Power Plane with Super-Wideband Elimination of Ground Bounce Noise on High Speed Circuit[J].IEEE Microwave and Wireless Components Letters,2005,15(3):174-176.
  • 7LI Long,CHEN Qiang,YUAN Qiaowei,et al.Ultrawideband Suppression of Ground Bounce Noise in Multilayer PCB Using Locally Embedded Planar Electromagnetic Band-Gap Structures[J].IEEE Antennas and Wireless Propagation Letters,2009,8:740-743.
  • 8JOO SUNG-HO,LEE DONG-YEOP KIMHAI-YOUNG.A S-Bridged Inductive Electromagnetic Bandgap Power Plane for Suppression of Ground Bounce Noise[J].IEEE Microwave and Wireless Components Letters,2007,17(10):709-711.
  • 9KIM MYUNGHOI,KOO KYOUNGCHOUL,KIM JOUNGHO,et al.Vertical Inductive Bridge EBG(VIB-EBG)Structure with Size Reduction and Stopband Enhancement for Wideband SSN Suppression[J].IEEE Microwave and Wireless Components Letters,2012,22(8):403-405.
  • 10KIM MYUNGHOI,KOO KYOUNGCHOUL,SHIM YUJEONG,et al.Vertical Stepped Impedance EBG(VSI-EBG)Structure for Wideband Suppression of Simultaneous Switching Noise in Multilayer PCBs[J].IEEE Transactions on Electromagnetic Compatibility,2013,55(2):307-314.

引证文献8

二级引证文献13

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部