溅射气压对快速制备Y_2O_3种子层的影响研究

Effect of sputtering pressure on the rapid preparation of Y_2O_3 seed layer

采用动式卷绕直流反应磁控溅射法,在双轴织构的Ni-5at%W基带上快速制备双面Y2O3种子层用于制备高质量YBa2Cu3O7-x(YBCO)涂层导体。研究了溅射气压对种子层织构和表面形貌的影响,以及不同溅射气压条件下种子层的两面一致性。优化工艺条件之后,制备出纯c轴取向的双面Y2O3种子层,其双面面外、面内半高宽分别为3.6°,3.4°和4.6°,4.3°,表面平整致密,平均晶粒尺寸约为40nm。

Double- sided Y2O03 layer was directly deposited on Ni -5at% W substrate by reel -to -reel direct -current magnetron reactive sputtering, serving as a seed layer for YBa2 Cu3O7 -x （YBCO） coated conductors. The influence of the sputtering pressure on the texture and surface morphology, and the uniformity of both sides under various pressure were detailed investigated. In the optimized process conditions, pure c- axis oriented double -sided Y2O3 seed layer was obtained with the Full - Width Half - Maximum （FWHM） of out of plane and in - plane were 3.6°, 3.4° and 4.6°, 4.3°, respectively, and atomic force microscopy revealed a continuous, dense, and crack - free with the average grain size of around 40nm, which potentially acted as the sufficiently good seed layer for the production of long length coated conductors.