摘要
针对嵌入式系统构建中应用环境差异性问题,采用层次化、模块化的设计思想,设计了一个适应性较强的板级支持包BSP(board support package)框架。介绍了BSP的原理,描述了BSP框架内部应遵循的组织、规范、约定以及外部关联结构,并具体分析了BSP与Bootloader之间的关系。在多个嵌入式开发平台的应用实践表明,该BSP框架的实现可支持不同应用环境中嵌入式系统的快速构建,有效缩短嵌入式产品的开发周期。
Aiming at the problem of the application environment differences in building embedded system, an adaptable frame of board support package adopting hierarchical and modular design idea is proposed. Firstly, the principle of BSP is introduced. Then, Organization, specification and convention in internal frame of BSP and external associated structure are described, and the relationship between BSP and Bootloader is analyzed. Finally, it is applied into several embedded development platform show that the implementation of BSP can support rapid construction of embedded system in different application environment, and the development cycle of embedded production is shorten.
出处
《计算机工程与设计》
CSCD
北大核心
2012年第10期3812-3816,共5页
Computer Engineering and Design
基金
江西省教育厅青年科学基金项目(GJJ11105)
江西省教育厅科技计划基金项目(GJJ12310)
华东交通大学校立科研基金项目(09XX05)
