以PEEC方法分析MCM中导体板上同步开关噪声

Analysis of Simultaneously Switching Noise on the Conductive Planes in Multichip Module (MCM) with Partial Element Equivalent Circuit (PEEC) Method

在高速多芯片组件 ( MCM)电路里 ,随着频率的升高 ,进入 GHz频段 ,则系统的互连和封装结构对信号产生不利影响 ,如信号延时、互扰以及当多个驱动器被同时触发时 ,会引起同步开关噪声 ,此噪声会耦合到系统其他电路 ,导致门电路错误触发或失效 .文中利用部分元等效电路( PEEC)方法分析了高速 MCM电路系统中导体板上同步开关噪声 ,该方法与全波分析及其他场方法相比具有效率高、容易结合有源器件一起分析同步开关噪声的特点 ;与其他等效电路方法相比 ,具有参数提取简单、效率高、精度高等优点 .最后 ,比较了该方法与 FDTD方法的特性 ,并分析了电路中两种典型结构体 (电源 /接地板、电源板 /信号线 /接地板 )未加去耦电容和加上去耦电容后电源

In high speed MCMs, with clock frequency rising and reaching gigahertz, signal is affected by the interconnects in package structure and system, for example, producing signal delay, mutual disturbance etc. When many logic circuits switch at the same time, the simultaneous switching current would flow the power/ground plane, and arouse the fluctuating voltage on the power/ground plane and would couple to other circuits. At serious moment, it would make gate circuits “false switching”. PEEC was used to analyze simultaneously switching noise on the conductive planes in highspeed MCM circuit system. This method has higher efficiency than full wave and other field methods, and is easily connected with the active device. Compared with other equivalent circuit methods, it has the advantage of simple parameter extraction, highefficiency and high precision. The simulation result was provided together with a comparison of SSN analysis performed by the proposed method and FDTD. The simultaneously switching noise of two types of strutures (power/ground planes, power/signal line/ground planes) with and without decoupling capacitor were analyzed.