单槽脉冲电沉积制备铜/镍纳米多层膜及其性能

Preparation of nanoscale copper/nickel multilayered coating by pulsed electrodeposition in a single bath and its properties

用单槽脉冲电沉积法在含CuSO4、NiSO4和Na3C6H5O7的镀液中制备了不同调制波长的Cu/Ni纳米多层膜,对其进行了截面形貌观察及显微硬度测量。结果表明,制备的多层膜平整,层间界清晰。其显微硬度在调制波长为100nm时出现峰值。当调制波长大于100nm时,多层膜显微硬度的变化符合Hall-Petch关系;当调制波长小于100nm时,显微硬度开始下降。X射线衍射表明,膜层中存在压应力,Ni层形成了强(100)织构。

CufNi nanoscale multilayers were prepared by pulsed electrodeposition in a single bath containing CuSO4, NiSO4, and NaaC6HsO7. The cross-sectional morphology and microhardness of the multilayers were studied. The results showed that the nanoscale multilayers prepared are leveled and have clear lamellar structure. The microhardness reaches the maximum at a modulation wavelength of ca.100 nm, and corresponds to Hall-Petch relationship when the modulation wavelength is greater than 100 nm, but tends to reduces at a wavelength of less than 100 nm. The X-ray diffraction result showed that there exists a compressive stress in the nanoscale multilayers and a strong （100） texture formation in Ni layers.