摘要
根据微机电系统(MEMS)在承压能力与化学稳定性方面的要求,在国外文献的基础上配制得到一种作为Si-聚酰亚胺(PI)低温键合黏合剂的芳香类热固性共聚酯(ATSP)。使用ATSP在不同条件下对Si-PI进行低温键合,确定了适合ATSP键合的温度和压力条件,并对键合面的拉伸强度和化学性能进行测试。测试结果表明,Si-PI键合面的拉伸强度能够达到1.3 MPa以上,完全可以满足MEMS器件在承压能力方面的要求。同时,键合后的ATSP在丙酮、酒精、制冷剂R134a和1-甲基-2-吡咯烷酮等多种试剂中均具有良好的化学稳定性。
According to the pressure resistance and chemical stability requirements of MEMS,the aromatic thermosetting copolyester（ATSP） was developed for the low temperature bonding between silicon and polyimide（PI） based on foreign references.Through low temperature bonding experiments between silicon and polyimide under different conditions using ATSP,the proper ranges of the bonding temperature and pressure were observed for the low temperature bonding.Besides that,the bonding strength and chemical properties of the bonding layer were also tested.The results show that the tensile strength of the bonding layer is larger than 1.3 MPa,which is sufficient for the pressure resistance requirements of MEMS devices.Meanwhile,the post-bon-ding ATSP layer exhibits excellent chemical stability in several reagents,such as the acetone,alcohol,refrigerant R134a and 1-methyl-2-pyrrollidone.
出处
《微纳电子技术》
CAS
北大核心
2012年第10期667-672,共6页
Micronanoelectronic Technology
基金
国家自然科学基金资助项目(50976067)
