摘要
焊点可靠性的评估方法和试验被讨论得很多,但如何利用有限的资源来快速地评估现场应用单板长期可靠性之类的文献却很少见。从研究相关标准和文献入手,通过合理的假设和推断,设计出一种简便、适合工程应用的评估方法,并通过试验验证,从而达到了评估数以万计的单板焊点可靠性的目的。
The method to evaluate and test the soldering reliability has been discussed a lot. However, the literature about bow to effectively evaluate the long-term reliability of PCBs in the field application is very limited. With reference to related standards, a simple evaluation method specified for engineering applications was proposed relying on reasonable hypothesis and deduction. The method has been verified by our testing result, and it can meet the requirement for effective soldering reliability evaluation for thousands of PCBs.
出处
《电子产品可靠性与环境试验》
2012年第5期11-16,共6页
Electronic Product Reliability and Environmental Testing
关键词
焊点
断裂
随机振动
疲劳寿命
加速
solder joint
crack
random vibration
fatigue life
acceleration