摘要
综述了电镀、化学镀及电化学腐蚀等电化学技术在集成电路与混合集成电路加工、传统与先进封装、微电子机械系统制作等一些微细加工领域的应用。通过综述可以看出,电化学制备金属薄膜这种传统的工艺在新的应用领域里体现出其它一些薄膜制备工艺不具备的优势。
Applications of electrochemical techniques about electroplating, electroless plating and electro- chemical corrosion in the microfabrication fields including the integrated circuits, hybrid integrated circuit processing,trational and advanced packaging and MEMS were summarized in this article. It can be seen that the traditional electrochemical technology in the preparation of metal thin films has the unique advan- tage compared with other thin film preparation process in new application areas.
出处
《电镀与精饰》
CAS
北大核心
2012年第10期20-22,共3页
Plating & Finishing
关键词
电镀
化学镀
电化学腐蚀
微电子
electroplating
electroless plating
electrochemical corrosion
microelectronics