羟基乙叉二膦酸电解液预镀铜新工艺

A New Copper Pre-plating Process Using Hydroxy-1,1-diphosphonic Acid Bath

为了保护环境、消除污染,实现以无氰镀铜工艺代替氰化镀铜工艺,经实验研究,采用羟基乙叉二膦酸电解液镀铜工艺应用在铝合金零件表面镀铜/镍/铬工艺路线中预镀铜工序。经过生产实践证明,羟基乙叉二膦酸镀铜电解液深镀能力和均镀能力优良;镀液维护简单;镀层与铝合金基体结合力良好,产品合格率达99%以上。

For the sake of environmental protection and pollution control, and using non-cyanide copper plating process to replace cyanide copper plating process, a new copper pre-plating process using hydrox- yl- 1,1-diphosphonic acid bath for aluminum alloy parts was developed by experiments. Production prac- tice showed that this new bath has a good covering and throwing power, a simple maintenance, a greater binding strength and a qualification rate up to 99%.