热等静压Ta合金中的隐形胞状硬质强化结构

Hidden Cell Structure in Ta Alloys Prepared by HIP

采用增氧的纯钽金属粉末经热等静压(HIP)烧结制备成块体结构,在不同温度下进行高温退火,分析了热等静压和后续退火工艺试样的显微硬度。结果发现:在热等静压状态下的试样,其晶粒晶界处的显微硬度值很高,而晶粒中心处的显微硬度值较低,形成了一种表现为外层硬而内部软,类似于细胞单元的表面有硬化层形成的隐性的壳形网络结构。高温退火处理会减弱这种结构直至消失。

Using high temperature isostatic pressing（HIP）,the refractory Ta alloy compaction blocks were prepared,and annealed at different high temperatures.Microhardness was tested at different state.The results showed that under HIP station,the microhardness value on the grain boundary was very high,but the microhardness value on the grain center was low,formed as a hidden harden cell network structures similar to the unit cell had surface hardening layer,and when annealing temperature rising,cystiform strengthen structures would weaken and disappear.