磁控溅射设备中铜靶刻蚀形貌的仿真计算研究

Simulation of Surface Morphology Evolution of Sputtered Copper Target

提出了一种铜靶刻蚀形貌模拟方法,基于靶材溅射率与靶材表面磁场水平分量成正比的假设,以美国应用材料公司的小行星PVD磁控溅射装置为算例,实现了复杂运动轨迹铜靶刻蚀形貌的模拟,仿真计算结果与实际设备中铜靶刻蚀形貌有较好的一致性,为通过磁场分布研究靶材刻蚀形貌提供了一种理论方法。

The sputter etching of the copper target, exemplified with the asteroids physical vapor deposition mag- netron sputtering setup made in USA, was approximated, modeled, and simulated with the software package ANSYS. The influencing factors, such as the complicated magnetic field distributions and the ion trajectory, were evaluated with appro- pilate approximations. A novel simulation method was developed to evaluate the evolution of the surface morphology in the sputtering, based on the assumption that the sputtering rate is proportional to the horizontal component of the magnetic field on the target surface. The simulated results were found to be in good agreement with those of the experimental measurement.