底部焊接工艺重组方案的探讨

Discussion on BPR of Bottom Welding

本文简述了一种在PCB双面回流焊接时利用UV胶固定长引脚元件实现回流焊接的方法，包括关键设备丝网印刷机、PCB板在线气动翻板机、三段传送式三轴点胶机、PCB板uV胶水在线固化炉和回流焊炉。该工艺方法首先需要对原先的SMT生产线条进行改造。在丝网印刷机后增加PCB板在线气动翻板机，将PCB的BOT面翻转至TOP面，利用三段传送式三轴点胶机进行点胶，进行手插作业，进入紫外线胶水固化炉对UV胶进行固化处理，然后PCB板在线气动翻板机翻转，对PCB的BOT面进行SMT加工及回流焊加热固化低温焊膏，最终完成SMT和手插生产过程合并。

The paper briefly introduces a reflow soldering method using long footprint component fixed by UV glue during PCB double side reflow soldering, including key equipment such as silk printer, PCB board online pneumatic type plate turnover machine, three-segmented 3-axis dispensing machine, PCB board UV glue online curing oven and reflow oven. It is re- quired to rebuild the original SMT production line. The PCB board online pneumatic type plate turnover machine is put after the silk printer, which turns the BOT side of the PCB to the TOP side; then the three-segmented 3-axis dispensing machine dispenses glue. Af- ter manual insertion is over, the PCB board will be sent to the ultraviolet curing oven for curing treatment of UV glue. The PCB board will be upside down on the pneumatic type plate turnover machine, SMT assembly, reflow soldering, heating and curing solder paste will be done on its BOT side. SMT and manual insertion process are finally integrated