CuO掺杂对10NiO-NiFe_2O_4陶瓷致密化烧结及其力学性能的影响

Effect of CuO doping on the densification and mechanical properties of 10NiO-NiFe_2O_4 ceramics

采用冷压成型和常压烧结工艺制备CuO掺杂10NiO-NiFe2O4陶瓷,研究CuO掺杂量对10NiO-NiFe2O4陶瓷的致密度、抗折强度及热震稳定性的影响。结果表明,在1 300℃烧结温度下,掺杂CuO能够有效提高10NiO-NiFe2O4陶瓷的致密度,其中添加6%CuO试样的相对密度(95.55%)最大;掺杂CuO可大幅提高10NiO-NiFe2O4陶瓷的抗折强度,其中添加8%CuO试样的抗折强度(139MPa)最高,且在800℃下经过1次和3次热循环后,该试样的抗折强度损失率仅分别为5.7%和8.6%,表现出良好的抗热震性能。

10NiO-NiFe2O4 ceramics doped with CuO were prepared by cold pressing and sintering in air atmosphere.The effect of CuO addition on the densification,bending strength and thermal shock resistance was studied.The results show that CuO can improve the density efficiently,and the highest relative density is 95.55% found in the sample with 6% CuO sintered at 1 300 ℃.CuO can form solid solution with NiO,which can advance the densification process.The sample with 8% CuO doping shows optimal bending strength of 139 MPa and great thermal shock resistance,with strength loss of 5.7% and 8.6% after 1 cycle and 3 cycles of thermal shock at 800 ℃,respectively.