一种新型的单面蚀刻技术制备埋容电路板

New technology of single-side etching for manufacture of embedded capacitors PCB

介绍了一种新型的埋入电容电路板的单面蚀刻工艺。本工艺主要针对介质层厚度≤50μm的埋入电容材料,在制作单面图形时,不去掉未曝光一面的干膜及干膜保护膜,棕化后再过显影线将干膜去掉。对该工艺可行性进行了评估,并验证了其可靠性。实验结果表明,采用此工艺可以减少工艺难度,加工成本降低了3%,且产品合格率达86%以上。

The new single-side etching technology of embedded capacitors PCB, whose dielectric thickness was less than 50 μm, was introduced. In the new technology, the unexposed side films didn＇t be removed when manufacturing the single-side graph, atter brown-oxide, then removing the dry film by developing. The feasibility of the technology was evaluated and the reliability of the technology was verified. The results show that using this technology can reduce processing difficulty and the processing cost is down 3%; the qualified rate of the product is more than 86%.