摘要
研究试验表明,普通C5191锡磷青铜合金,通过对生产加工工艺进行调整,可改善C5191锡磷青铜合金箔带的力学性能,同时具有高的抗疲劳性能,屈强比达到0.95,可满足电子工业用高性能铜合金箔带的使用要求。
Research trial shows that mechanical properties of ordinary C5191 tin-phosphorous-bronze-alloy foil can be im- proved by adjusting the produetion process of ordinary C5191 tin-phosphorous-bronze-alloy which also results in high fatigue resistance and a tensile ratio of 0.95, and thus it meets the requirements of copper alloy foil for electronics industry.
出处
《甘肃冶金》
2012年第5期31-34,共4页
Gansu Metallurgy
关键词
铜合金箔带
抗疲劳性能
屈强比
超薄化
屈服强度
copper alloy foil tape
anti-fatigue performance
yield ratio
ultra-thi
yield strength
