摘要
使用环形金刚石线直径为0.70毫米,长4米,切割直径53毫米的蓝宝石晶体,30分钟即可完成切割。论文研究切割线速度,进给速度等对蓝宝石切割面粗糙度的影响。通过试验找到环形金刚石线切割蓝宝石片的最佳工艺参数并对其切割机理进行了探讨。
This paper has introduced the experiment of cutting sapphire with looped diamond wire.A sapphire cylinder with diameter of 2 inches could be cut off in 30 minutes by using a looped diamond wire with diameter of 0.7 mm and length of 4 meters.The influences of cutting parameters on the surface roughness of the wafer are studied such as linear velocity,cutting feed rate and so on.The optimal technological parameters are obtained and the cutting mechanism simultaneously is discussed by the experiment.
出处
《超硬材料工程》
CAS
2012年第4期5-8,共4页
Superhard Material Engineering